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氨基磺酸盐镀镍的优势性能详解
来源:http://www.jnjrh.com 日期:2019-10-02 发布人:admin
盐镀镍层的最大优点是应力较低,且镀速快,适宜电铸镍及印制板镀金的底层。
The greatest advantage of salt nickel plating is that the stress is low and the plating speed is fast. It is suitable for electroforming nickel and gold plating on PCB.
由于镍本身有张应力,普通镍层不是太厚时,应力效果不大。当电铸镍时,厚度请求较高,应力效果会构成电铸件变形。而盐镀镍工艺调整得好(主要靠加糖精来调整),镀镍层应力要比用其他镀镍工艺得到的镀镍层小许多。用盐镀镍工艺得到的镀层应力与镀液的pH值、温度、电流密度有接近的联络,严厉按照工艺停止施镀,最佳组合可取得零应力镀层。所以特别顺应于模具制造等职业。
Because of the tension stress of nickel itself, the stress effect of common nickel layer is not very good when it is not too thick. When nickel is electroformed, the thickness requirement is higher, and the stress effect will form the deformation of the electroformed parts. The salt nickel plating process is well adjusted (mainly by adding saccharin), and the stress of nickel plating layer is much smaller than that of other nickel plating processes. The stress of the plating layer obtained by salt nickel plating process is closely related to the pH value, temperature and current density of the plating solution. The plating process should be stopped strictly according to the process. The optimum combination can achieve zero stress plating. So in particular, conform to the mold manufacturing and other occupations.
氨基磺酸
要留意的是操控欠好应力相同可以很大。不要以为用了盐镀镍工艺就必定得到低应力镀层。
It should be noted that the same stress can be very large if the control is not good. Don't assume that the low stress coating will be obtained by using the salt nickel plating process.
盐镀镍工艺缺陷是本钱较高。
The defect of salt nickel plating process is higher cost.
相信看了本文的介绍后,对这方面也会有自己的一番认识,以后针对的氨基磺酸http://www.jnjrh.com等问题也能很好的解决。
I believe that after reading the introduction of this article, I will have my own understanding of this aspect, and the problems of aminosulfonic acid http://www.jnjrh.com can also be solved well in the future.