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氨基磺酸镀镍液的提取的方式你清楚吗?
来源:http://www.jnjrh.com 日期:2019-09-13 发布人:admin
一个目的在于提供一种氨基磺酸镍电镀液,包括酸 镍、硼酸和氯化镍。用该电镀液电镀金属表面,形成的镀层稳定性良好、 且连续完整、无针孔、无起泡脱落,镀层无残余应力。
One aim is to provide a nickel sulfamate electroplating solution, including nickel sulfamate, boric acid and nickel chloride. The plating bath is used to electroplate the metal surface, and the formed coating is stable, continuous and complete, without pinholes, foaming and falling off, and without residual stress.
本发明的另一个目的在于提供一镍电镀液,包镍、硼酸、氯化镍和光亮剂。用该电镀液电镀金属表面,形成的镀层稳定性良好、且连续完整、无针孔、无起泡脱落,镀层无残余应力。加入光亮剂后制得的镀层更平整和光亮。
Another object of the invention is to provide a nickel sulfamate electroplating solution, including nickel sulfamate, boric acid, nickel chloride and brightener. The plating bath is used to electroplate the metal surface, and the formed coating is stable, continuous and complete, without pinholes, foaming and falling off, and without residual stress. The coatings prepared by adding brightener are smoother and brighter.
本发明的另一个目的在于提供一种酸镍电镀方法,铝合金使用该方法电镀镍后,制得的产品表面形成稳定性良好、光亮平整、连续完整、无起泡脱落的镍镀层。
Another object of the present invention is to provide a nickel sulfamate plating method. After nickel plating on aluminium alloy by this method, a nickel coating with good stability, smooth surface, continuous integrity and no foaming and falling off is formed on the product surface.
本发明所述的氨基镍镀液通过液体镍、缓冲液和氯化镍
The nickel sulfamate plating solution of the invention passes through liquid nickel sulfamate, buffer and nickel chloride.
的组合,形成pH值范围为3.1—4.9的混合电镀盐溶液。
氨基磺酸
A mixed electroplating salt solution with pH ranging from 3.1 to 4.9 was formed.
电镀过程中,氨基磺酸镍提供不断消耗的N产离子,其含量范围选择较宽。当其在电镀液中的含量较低时(小于200g/L),镀液分散性好,所得镀层结晶细致,但沉积速度慢。当其在电镀液中的含量过高时(大于800g/L),镀液分散性差,从而使得镀液带出量大。
In the electroplating process, nickel aminosulfonate provides continuously consumed N-producing ions, and its content range is wide. When its content in the electroplating bath is low (less than 200g/L), the electroplating bath has good dispersion and fine crystallization, but the deposition rate is slow. When its content in the plating solution is too high (more than 800g/L), the dispersion of the plating solution is poor, which makes the plating solution take out a large amount.
氯化镍具有较好的水溶性,并为电镀提供氯离子。镀液中的氯离子使得阳极溶解的N产离子与Cl—离子相互作用并迅速扩散,从而防止阳极区N产离子浓度过高而发生的阳极钝化情形,还能进一步加快N产离子在阳极的溶解。当氯离子浓度过高时(大于50g/L),所制得的镀层硬度及内应力过大。氯离子浓度较低时(小于2.7g/L),虽然所得镀层延展性好,内应力也低,但是易导致阳极钝化和pH值下降,使得镀液不稳定。
Nickel chloride has good water solubility and provides chloride ion for electroplating. The chloride ion in the plating bath causes the interaction and rapid diffusion of N-producing ions and Cl-ions in the anodic solution, thus preventing the anodic passivation caused by the excessive concentration of N-producing ions in the anodic region, and further accelerating the dissolution of N-producing ions in the anode. When the concentration of chloride ion is too high (more than 50g/L), the hardness and internal stress of the coatings are too high. When chloride ion concentration is lower (less than 2.7g/L), although the obtained coating has good ductility and low internal stress, it is easy to cause anodic passivation and decrease of pH value, which makes the plating bath unstable.
缓冲液起到控制电镀液pH值的作用。pKa值在3.1—4.9范围内的弱酸及其盐均可以作为本发明所述电镀液的缓冲液使用。常用缓冲液如50mM甘氨酸一盐酸(pH范围2.2 — 5.0) 、 50mM邻笨二甲酸一盐酸(pH范围2.2 —3.8) 、 100mM柠檬酸一拧檬酸钠(pH范围3.0 — 6.6)禾口200mM乙酸一乙酸钠(pH范围3.6 —5.8)等。
The buffer plays a role in controlling the pH value of the plating bath. Weak acids and salts with pKa values ranging from 3.1 to 4.9 can be used as buffers for the plating bath of the present invention. Common buffer solutions such as 50mM glycine hydrochloric acid (pH range 2.2-5.0), 50mM phthalic acid hydrochloric acid (pH range 2.2-3.8), 100mM citric acid sodium citrate (pH range 3.0-6.6) and Hekou 200mM sodium acetate-acetic acid (pH range 3.6-5.8), etc.
一种氨基磺酸镍电镀液由镍、硼酸和氯化镍组成,其中镍的浓度为100—1000g/L,硼酸浓度为10—100g/L,氯化镍浓度为5 — 90g/L,溶液pH值为3.5 — 4.5。
A nickel sulfamate electroplating bath is composed of nickel sulfamate, boric acid and nickel chloride. The concentration of nickel sulfamate is 100-1000g/L, boric acid is 10-100g/L, nickel chloride is 5-90g/L, and solution pH value is 3.5-4.5.
另一种氨基电镀液由氨基镍、硼酸和氯化镍组成,其中镍的浓度为200 — 800g/L,硼酸浓度为10_100g/L,氯化镍浓度为5 — 90g/L,溶液pH值为3.8 —4.2。
Another nickel sulfamate electroplating bath is composed of nickel sulfamate, boric acid and nickel chloride. The concentration of nickel sulfamate is 200-800 g/L, boric acid is 10-100 g/L, nickel chloride is 5-90 g/L, and solution pH value is 3.8-4.2.