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氨基磺酸镍的使用用途及特点
来源:http://www.jnjrh.com 日期:2018-12-28 发布人:admin
氨基磺酸镍是氨基磺酸的下游产品之一,分子式Ni(SO3NH2)2·4H2O ,是一种优良的电镀主盐,因其内应力低、电镀速度快,溶解度大,无污染等,广泛用途于精细电镀和镍钴合金电铸,特别用途于连接器电镀、印刷电路板电镀、结晶器铜板电铸,以及功能性电镀及塑料化学镀、镍钴合金电镀等的氨基磺酸镍电镀工艺。
Nickel sulfamate is one of the downstream products of sulfamic acid. Molecular formula Ni(SO3NH2)2.4H_2O is an excellent main salt for electroplating. Because of its low internal stress, fast electroplating speed, high solubility and no pollution, it is widely used in fine electroplating and Nickel-Cobalt Alloy electroforming, especially in connector electroplating, printed circuit board electroplating, mould copper plate electroforming, and functional electroplating and plastics. Electroless plating, nickel-cobalt alloy plating and other nickel sulfamate plating processes.
氨基磺酸镍为绿色结晶体,易潮解,易溶于水为氨基磺酸镍溶液(国家标准编号为GB/T 23847-2009),水溶液呈酸性,有吸湿性;氨基磺酸镍供给镀镍所需的镍金属离子并兼起着导电盐的作用,镍盐含量高,可以运用较高的阴极电流密度,堆积速度快,常用作高速镀厚镍,可是浓度过高将下降阴极极化,涣散能力差,并且镀液的带出丢失,镍盐含量低堆积速度低,可是涣散能力很好,能获得结晶详尽亮光镀层,咱们一般运用的氨基磺酸镍镀液配方是:
Nickel sulfamate is a green crystal, easy to be deliquescent, soluble in water as nickel sulfamate solution (national standard No. GB/T 23847-2009). The solution is acidic and hygroscopic. Nickel sulfamate supplies nickel metal ions for nickel plating and acts as conductive salts. Nickel salts have high content and can be used with high cathode current density and high stacking speed. It is often used for high-speed thick nickel plating. However, if the concentration is too high, the cathodic polarization will be reduced, the dispersion ability will be poor, and the bath will be lost. The nickel salt content is low and the accumulation rate is low. However, the dispersion ability is very good, and the bright and crystalline coating can be obtained. The formula of nickel sulfamate plating solution is as follows:
氨基磺酸镍:650.0-780.0g/L
Nickel sulfamate: 650.0-780.0g/L
六水氯化镍:5.0-8.0g/L
Nickel chloride hexahydrate: 5.0-8.0g/L
硼酸:35.0-45.0g/L
Boric acid: 35.0-45.0g/L
湿润剂:W0.3mL
Wetting agent: W0.3mL
氨基磺酸
添加剂:M8.0mL
Additives: M8.0mL
水加至:1.0L
Water added to: 1.0L
氨基磺酸镍电镀工艺条件:
Nickel sulfamate electroplating process conditions:
温度50—58℃,pH值4.0—4.8,电流密度5~llA/dm2,阳极为纽扣形含硫镍圆饼或普通电解镍圆饼,使用津南大化工厂的氨基磺酸镍镀液配方,可进行各种氨基磺酸镍电镀工艺,其电镀液堆积速度快,涣散能力强,镀层应力少,电流效率可达99%以上。
Temperature 50-58 C, pH 4.0-4.8, current density 5-llA/dm2, anode button-shaped nickel cake containing sulphur or ordinary electrolytic nickel cake, using the formula of nickel sulfamate plating solution of Jinnan University Chemical Plant, various nickel sulfamate plating processes can be carried out. The plating solution has fast accumulation speed, strong dispersibility, less coating stress, and current efficiency can reach more than 99%.
氨基磺酸镍溶液的优势 :
Advantages of nickel sulfamate solution:
1、镀液电流效率高,可节约电镀时间,提高生产效率。
1. High current efficiency of plating solution can save plating time and improve production efficiency.
2、镀层结晶详尽,均匀滑润,色泽亮光。
2. The coating is well crystallized, smooth and bright in color.
3、镀层内应力低,堆积速度快,溶解度大,无污染,延展性好,焊锡性佳;镀层含硫量低,少于0.003%。
3. The coating has low internal stress, fast accumulation speed, high solubility, no pollution, good ductility and good solderability. The sulfur content of the coating is low, less than 0.003%.
4、合适喷沙或磨沙工件电镀,工件处理能保持其原有砂纹特性及外观。
4. Suitable for sand blasting or grinding workpiece electroplating, workpiece processing can maintain its original grain characteristics and appearance.
5、适用于低应力镍镀层之要求的使用,如电铸等。
5. Suitable for low stress nickel plating, such as electroforming.
6、特别适用于功能性电镀,常用作金、钯、铑、银等贵金属电镀和非金属电镀打底镀层。
6. It is especially suitable for functional plating. It is often used as base plating for gold, palladium, rhodium, silver and other precious metals.
7、极适宜于电子电镀之接连电镀、TAB电镀、快速电镀及要求较高的小孔径高精细线路板电镀。
7. Suitable for continuous electroplating, TAB electroplating, fast electroplating and high-precision small aperture circuit board electroplating.
氨基磺酸镍用途:
Use of nickel sulfamate:
一:用于电子工业
First: for the electronic industry
二:用于精细仪器的电镀
II: Electroplating for Fine Instruments
三:首要用于精细镀镍、精细电镀,其长处是镀层的内应力低,堆积速度快。
3. It is mainly used for fine nickel plating and fine electroplating. Its advantage is that the internal stress of the coating is low and the stacking speed is fast.
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